JAXA Repository / AIREX 未来へ続く、宙(そら)への英知

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title有限要素法を用いた熱・振動複合環境下におけるはんだ接合部の疲労寿命評価
Other TitleReliability evaluation with Finite Element Method of solder joints under the multiple stresses of thermal circumstance and vibration
Author(jpn)松嶋, 道也
Author(eng)Matsushima, Michiya
Author Affiliation(jpn)大阪大学工学研究科
Author Affiliation(eng)Graduate School of Engineering, Osaka University
Issue Date2011-04
Publisher宇宙航空研究開発機構宇宙科学研究所 (JAXA)(ISAS)
Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency (JAXA)(ISAS)
Publication title第21回高温エレクトロニクス研究会
Proceedings of the 21st ISAS Research Meeting on HIGH TEMPERATURE ELECTRONICS
Start page58
End page71
Publication date2011-04
Languagejpn
Description会議情報: 第21回高温エレクトロニクス研究会(2011年3月2日. 宇宙航空研究開発機構宇宙科学研究所(JAXA)(ISAS)), 相模原市, 神奈川県
Meeting Information: The 21st ISAS Research Meeting on High Temperature Electronics (March 2, 2011. Institute of Space and Astronautical Science, Japan Aerospace Exploration Agency (JAXA)(ISAS)), Sagamihara, Kanagawa Japan
Document TypeConference Paper
JAXA Categoryシンポジウム・研究会
SHI-NOSA6000018006
URIhttps://repository.exst.jaxa.jp/dspace/handle/a-is/8026


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