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AD1610001000

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1. Component Miniaturization and High-Density Technologies in Space Applications 部品の小型化技術・高密度技術の宇宙適用
(著者名) 根本, 規生
(Author) Nemoto, Norio
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-20
(言語) eng(資料番号) AD1610001001
2. 宇宙機および衛星のワイヤレス化を支えるマイクロ波半導体デバイス・集積回路技術と無線電力伝送 Microwave Semiconductor Device / Integrated Circuit Technology and Wireless Powering for a Spacecraft and a Satellite
(著者名) 川崎, 繁男
(Author) Kawasaki, Shigeo
(内容記述) 会議情報: 第27回マイクロエレクトロニクスワークショップ(MEWS27) (2014年10月23日-24日. つくば国際会議場), つくば市, 茨城
(文献種別) Presentation
(ページ) 1-29
(言語) jpn(資料番号) AD1610001002
3. 携帯電話における高密度実装 High Density Assembly for Mobile Phone Use
(著者名) 石田, 裕司
(Author) Ishida, Yuji
(内容記述) 会議情報: 第27回マイクロエレクトロニクスワークショップ(MEWS27) (2014年10月23日-24日. つくば国際会議場), つくば市, 茨城
(文献種別) Presentation
(ページ) 1-33
(言語) jpn(資料番号) AD1610001003
4. 小型移動通信機器を支える小型・高密度化技術 Small and High Density Technologies that support Small Mobile Communication Instruments
(著者名) 古本, 雄一
(Author) Furumoto, Yuuichi
(内容記述) 会議情報: 第27回マイクロエレクトロニクスワークショップ(MEWS27) (2014年10月23日-24日. つくば国際会議場), つくば市, 茨城
(文献種別) Presentation
(ページ) 1-31
(言語) jpn(資料番号) AD1610001004
5. NASA's Approach to Space Parts Miniaturization
(Author) Agarwal, Shri G.; Sampson, Michael J.
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-23
(言語) eng(資料番号) AD1610001005
6. New Technology Insertion in Military and Space Standards at SAE SSTC-G12 and JEDEC JC-13
(Author) Touw, Anduin E.
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-18
(言語) eng(資料番号) AD1610001006
7. High Density Microelectronic Package Solutions for Space
(Author) Watanabe, Keith
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-32
(言語) eng(資料番号) AD1610001007
8. New Void Free Surface Mount Devices: Small, Lightweight Components for Increased Efficiency in Space Applications
(Author) Thompson, Joe
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-11
(言語) eng(資料番号) AD1610001008
9. Applications of Wafer Level Chip Scale Packaging in Space Systems Wafer Level Chip Scale Packaging (WLCSP)
(Author) Mansilla, Oscar
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(言語) eng(資料番号) AD1610001009
10. Qualification and Manufacturing processes for High Performance , Space Grade Microprocessors
(Author) Glascott-Jones, Andrew; Marriotini, S.; Chantier, N.; et al.
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-23
(言語) eng(資料番号) AD1610001010
11. ST-New European Rad-Hard Products for Space
(Author) Brunet, Thibault
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-22
(言語) eng(資料番号) AD1610001011
12. Discrete Components versus Miniaturization - A contradiction ?
(Author) Kuebler, Wolfgang
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-13
(言語) eng(資料番号) AD1610001012
13. RTG4 - Next Generation Space-Flight FPGA
(Author) Nguyen, Minh
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-33
(言語) eng(資料番号) AD1610001013
14. ATMX150RHA Rad-Hard Platform, the solution for mixed-signal ASIC
(Author) Bancelin, Bernard
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-37
(言語) eng(資料番号) AD1610001014
15. Discrete Semiconductor and Microelectronics Product Lines
(Author) Walker, Jeffrey L.
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(言語) eng(資料番号) AD1610001015
16. A 130 nm Radiation Hardened ARM CORTEX M0 Microprocessor - High Density Technology for Space
(Author) Martins, Jose Silva
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-23
(言語) eng(資料番号) AD1610001016
17. Aeroflex Non-Volatile and Volatile Memory Solutions
(Author) Mundie, Michelle
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-14
(言語) eng(資料番号) AD1610001017
18. Radiation Tolerant DDR2 and DDR2 Termination Regulator 3D Plus Space Products 72b DDR2 & DDR2 TR Modules
(Author) Esther Garcia Sanchez
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(言語) eng(資料番号) AD1610001018
19. Radiation testing (TID) of complex integrated circuits TID testing of complex integrated circuits
(Author) Bermudo, Miguel
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(ページ) 1-20
(言語) eng(資料番号) AD1610001019
20. Optimised Supply Strategy for Space applications as a vehicle for new technologies
(Author) Koder, Achim; Mosken, Michael
(内容記述) Meeting Information: The 27th Microelectronics Workshop (MEWS27) (October 23-24, 2014. Tsukuba Inter...
(文献種別) Presentation
(言語) eng(資料番号) AD1610001020
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