| タイトル | High temperature adhesives |
| 本文（外部サイト） | http://hdl.handle.net/2060/19920013217 |
| 著者（英） | St.clair, Terry L. |
| 著者所属（英） | NASA Langley Research Center |
| 発行日 | 1991-12-01 |
| 言語 | eng |
| 内容記述 | The aerospace and electronics industries have an ever increasing need for higher performance materials. In recent years, linear aromatic polyimides have been proven to be a superior class of materials for various applications in these industries. The use of this class of polymers as adhesives is continuing to increase. Several NASA Langley developed polyimides show considerable promise as adhesives because of their high glass transition temperatures, thermal stability, resistance to solvents/water, and their potential for cost effective manufacture. |
| NASA分類 | NONMETALLIC MATERIALS |
| レポートNO | 92N22460 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/127831 |
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