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タイトルFabrication and optimization of a whiskerless Schottky barrier diode for submillimeter wave applications
本文(外部サイト)http://hdl.handle.net/2060/19910001831
著者(英)Bishop, W.; Mattauch, R. J.
著者所属(英)Virginia Univ.
発行日1990-03-01
言語eng
内容記述The following accomplishments were made towards the goal of an optimized whiskerless diode chip for submillimeter wavelength applications. (1) Surface channel whiskerless diode structure was developed which offers excellent DC and RF characteristics, reduced shunt capacitance and simplified fabrication compared to mesa and proton isolated structures. (2) Reliable fabrication technology was developed for the surface channel structure. The new anode plating technology is a major improvement. (3) DC and RF characterization of the surface channel diode was compared with whisker contacted diodes. This data indicates electrical performance as good as the best reported for similar whisker contacted devices. (4) Additional batches of surface channel diodes were fabricated with excellent I-V and reduced shunt capacitance. (5) Large scale capacitance modelinng was done for the planar diode structure. This work revealed the importance of removing the substrate gallium arsenide for absolute minimum pad capacitance. (6) A surface channel diode was developed on quartz substrate and this substrate was completely removed after diode mounting for minimum parasitic capacitance. This work continues with the goal of producing excellent quality submillimeter wavelength planar diodes which satisfy the requirements of easy handling and robustness. These devices will allow the routine implementation of Schottky receivers into space-based applications at frequencies as high as 1 THz, and, in the future, beyond.
NASA分類ELECTRONICS AND ELECTRICAL ENGINEERING
レポートNO91N11144
NAS 1.26:186381
UVA/528247/EE90/101
NASA-CR-186381
権利No Copyright
URIhttps://repository.exst.jaxa.jp/dspace/handle/a-is/135566


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