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タイトルAttachment of lead wires to thin film thermocouples mounted on high temperature materials using the parallel gap welding process
本文(外部サイト)http://hdl.handle.net/2060/19900012045
著者(英)Holanda, Raymond; Pencil, Eric; Kim, Walter S.; Groth, Mary; Danzey, Gerald A.
著者所属(英)NASA Lewis Research Center
発行日1990-01-01
言語eng
内容記述Parallel gap resistance welding was used to attach lead wires to sputtered thin film sensors. Ranges of optimum welding parameters to produce an acceptable weld were determined. The thin film sensors were Pt13Rh/Pt thermocouples; they were mounted on substrates of MCrAlY-coated superalloys, aluminum oxide, silicon carbide and silicon nitride. The entire sensor system is designed to be used on aircraft engine parts. These sensor systems, including the thin-film-to-lead-wire connectors, were tested to 1000 C.
NASA分類INSTRUMENTATION AND PHOTOGRAPHY
レポートNO90N21361
E-5218
NASA-TM-102442
NAS 1.15:102442
権利No Copyright
URIhttps://repository.exst.jaxa.jp/dspace/handle/a-is/138236


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