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タイトルEffect of adherend thickness and mixed mode loading on debond growth in adhesively bonded composite joints
本文(外部サイト)http://hdl.handle.net/2060/19870007449
著者(英)Everett, R. A., Jr.; Johnson, W. S.; Mangalgiri, P. D.
著者所属(英)NASA Langley Research Center
発行日1986-09-01
言語eng
内容記述Symmetric and unsymmetric double cantilever beam (DCB) specimens were tested and analyzed to assess the effect of: (1) adherend thickness, and (2) a predominantly mode I mixed mode loading on cyclic debond growth and static fracture toughness. The specimens were made of unidirectional composite (T300/5208) adherends bonded together with EC3445 structural adhesive. The thickness was 8, 16, or 24 plies. The experimental results indicated that the static fracture toughness increases and the cyclic debond growth rate decreases with increasing adherend thickness. This behavior was related to the length of the plastic zone ahead of the debond tip. For the symmetric DCB specimens, it was further found that displacement control tests resulted in higher debond growth rates than did load control tests. While the symmetric DCB tests always resulted in cohesive failures in the bondline, the unsymmetric DCB tests resulted in the debond growing into the thinner adherend and the damage progressing as delamination in that adherend. This behavior resulted in much lower fracture toughness and damage growth rates than found in the symmetric DCB tests.
NASA分類COMPOSITE MATERIALS
レポートNO87N16882
NASA-TM-88992
AVSCOM-TR-86-B-2
NAS 1.15:88992
権利No Copyright
URIhttps://repository.exst.jaxa.jp/dspace/handle/a-is/152178


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