| タイトル | Monolithic microwave integrated circuits: Interconnections and packaging considerations |
| 本文（外部サイト） | http://hdl.handle.net/2060/19840023391 |
| 著者（英） | Anzic, G.; Connolly, D. J.; Romanofsky, R. R.; Bhasin, K. B.; Ponchak, G. E.; Downey, A. N. |
| 著者所属（英） | NASA Lewis Research Center |
| 発行日 | 1984-01-01 |
| 言語 | eng |
| 内容記述 | Monolithic microwave integrated circuits (MMIC's) above 18 GHz were developed because of important potential system benefits in cost reliability, reproducibility, and control of circuit parameters. The importance of interconnection and packaging techniques that do not compromise these MMIC virtues is emphasized. Currently available microwave transmission media are evaluated to determine their suitability for MMIC interconnections. An antipodal finline type of microstrip waveguide transition's performance is presented. Packaging requirements for MMIC's are discussed for thermal, mechanical, and electrical parameters for optimum desired performance. |
| NASA分類 | COMMUNICATIONS AND RADAR |
| レポートNO | 84N31461
NAS 1.15:83774
E-2266
NASA-TM-83774 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/158683 |
