| タイトル | Ultra high speed image processing techniques |
| 本文（外部サイト） | http://hdl.handle.net/2060/19820011592 |
| 著者（英） | Anthony, T.; Billings, J.; Connery, R.; Ehland, J.; Hoeschele, D. F. |
| 著者所属（英） | General Electric Co. |
| 発行日 | 1981-04-01 |
| 言語 | eng |
| 内容記述 | Packaging techniques for ultra high speed image processing were developed. These techniques involve the development of a signal feedthrough technique through LSI/VLSI sapphire substrates. This allows the stacking of LSI/VLSI circuit substrates in a 3 dimensional package with greatly reduced length of interconnecting lines between the LSI/VLSI circuits. The reduced parasitic capacitances results in higher LSI/VLSI computational speeds at significantly reduced power consumption levels. |
| NASA分類 | ELECTRONICS AND ELECTRICAL ENGINEERING |
| レポートNO | 82N19466
NASA-CR-166771 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/166815 |
