| タイトル | Low-temperature solder for joining large cryogenic structures |
| 本文（外部サイト） | http://hdl.handle.net/2060/19800023982 |
| 著者（英） | Buckley, J. D.; Sandefur, P. G., Jr. |
| 著者所属（英） | NASA Langley Research Center |
| 発行日 | 1980-09-01 |
| 言語 | eng |
| 内容記述 | Three joining methods were considered for use in fabricating cooling coils for the National Transonic Facility. After analysis and preliminary testing, soldering was chosen as the cooling coil joining technique over mechanical force fit and brazing techniques. Charpy V-Notch tests, cyclic thermal tests (ambient to 77.8 K) and tensile tests at cryogenic temperatures were performed on solder joints to evaluate their structural integrity. It was determined that low temperature solder can be used to ensure good fin-to-tube contact for cooling-coil applications. |
| NASA分類 | METALLIC MATERIALS |
| レポートNO | 80N32490
L-13712
NASA-TM-81836 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/171223 |
