| タイトル | High-temperature adhesives for bonding polyimide film |
| 本文（外部サイト） | http://hdl.handle.net/2060/19800017950 |
| 著者（英） | Slemp, W. S.; St.clair, T. L.; St.clair, A. K. |
| 著者所属（英） | NASA Langley Research Center |
| 発行日 | 1980-05-01 |
| 言語 | eng |
| 内容記述 | Experimental polyimide resins were developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575 K (575 F) in vacuum. Glass transition temperatures of the polyimide/"Kapton" bondlines were monitored by thermomechanical analysis. |
| NASA分類 | NONMETALLIC MATERIALS |
| レポートNO | 80N26449
NASA-TM-81824 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/172182 |
