| タイトル | Bend strengths of reaction bonded silicon nitride prepared from dry attrition milled silicon powder |
| 本文（外部サイト） | http://hdl.handle.net/2060/19790022208 |
| 著者（英） | Herbell, T. P.; Glasgow, T. K. |
| 著者所属（英） | NASA Lewis Research Center |
| 発行日 | 1979-01-01 |
| 言語 | eng |
| 内容記述 | Dry attrition milled silicon powder was compacted, sintered in helium, and reaction bonded in nitrogen-4 volume percent hydrogen. Bend strengths of bars with as-nitrided surfaces averaged as high as 210 MPa at room temperature and 220 MPa at 1400 C. Bars prepared from the milled powder were stronger than those prepared from as-received powder at both room temperature and at 1400 C. Room temperature strength decreased with increased milling time and 1400 C strength increased with increased milling time. |
| NASA分類 | NONMETALLIC MATERIALS |
| レポートNO | 79N30379
DOE/NASA/1040-79/8
NASA-TM-79230
E-132 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/174772 |
