| タイトル | Development of a highly reliable composite board for printed circuitry for use in space environment |
| 本文（外部サイト） | http://hdl.handle.net/2060/19720004488 |
| 著者（英） | Markle, R. A.; Dunnavant, W. R.; Stickney, P. B.; Bradbury, E. J. |
| 著者所属（英） | Battelle Memorial Inst. |
| 発行日 | 1971-10-30 |
| 言語 | eng |
| 内容記述 | Materials, processes and fabrication techniques have been investigated for the development of a high-temperature circuit-board laminate. High quality, void-free copper-clad laminates have been made using 7628/HS-1 style fiberglas reinforcements with filled polyimide matrices. The fabricating characteristics of P13N resin appear suitable for use as a filled matrix in this circuit board development. High-fired, ball-milled alumina appears to be necessary to obtain the desired effects in the circuit board system. Nickel-clad copper foil bonding surfaces appear to be another requirement for retention of good bond strengths after art work and plating sequences. The fabrication cycle for this circuit board system is very dependent on the heating profile. Very rapid heating with quick loading is recommended. A stack approach to lamination was successfully used. |
| NASA分類 | ELECTRONIC EQUIPMENT |
| レポートNO | 72N12137
NASA-CR-124031 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/204772 |
|
