| タイトル | Cryogenic Insulation Bondline Studies for Reusable Launch Vehicles |
| 本文（外部サイト） | http://hdl.handle.net/2060/20040041302 |
| 著者（英） | Duong, P. G.; Johnson, T. F.; Weiser, E. S. |
| 著者所属（英） | NASA Langley Research Center |
| 発行日 | 2003-11-19 |
| 言語 | eng |
| 内容記述 | Cryogenic insulations bonded to metallic substrates were characterized under simulated mission conditions representative for a reusable launch vehicle. The combined thermal and mechanical test consisted of 50 to a 100 cycles. These combined thermal and mechanical cycles simulated flight missions with temperatures ranging from -423 F to 450 F and a maximum mechanical tension load ranging from 20,000 lbs. to 97,650 lbs. The combined thermal and mechanical (uniaxial tension) test apparatus (1 ft. by 2 ft. Test Apparatus) developed at the NASA Langley Research Center, was used to perform cyclic tests on cryogenic insulations bonded to tank wall substrates. No visual delamination or degradation was observed in the cryogenic insulation-to-metallic substrate bondline or butt joints between cryogenic insulation panels. In addition, after cyclic testing was performed, residual property results from tension-pull and closed-cell content tests of the cryogenic insulations indicated a decrease in the bondline strength and closed-cell content. |
| NASA分類 | Launch Vehicles and Launch Operations |
| 権利 | No Copyright |
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