| タイトル | Low-melt Viscosity Polyimide Resins for Resin Transfer Molding (RTM) II |
| 本文（外部サイト） | http://hdl.handle.net/2060/20070011454 |
| 著者（英） | Criss, Jim M.; Nguyen, Baochau N.; Scheiman, Daniel A.; Mintz, Eric A.; McCorkle, Linda S.; Chuang, Kathy C. |
| 著者所属（英） | NASA Glenn Research Center |
| 発行日 | 2007-01-01 |
| 言語 | eng |
| 内容記述 | A series of polyimide resins with low-melt viscosities in the range of 10-30 poise and high glass transition temperatures (Tg s) of 330-370 C were developed for resin transfer molding (RTM) applications. These polyimide resins were formulated from 2,3,3 ,4 -biphenyltetracarboxylic dianhydride (a-BPDA) with 4-phenylethynylphthalic anhydride endcaps along with either 3,4 - oxyaniline (3,4 -ODA), 3,4 -methylenedianiline, (3,4 -MDA) or 3,3 -methylenedianiline (3,3 -MDA). These polyimides had pot lives of 30-60 minutes at 260-280 C, enabling the successful fabrication of T650-35 carbon fiber reinforced composites via RTM process. The viscosity profiles of the polyimide resins and the mechanical properties of the polyimide carbon fiber composites will be discussed. |
| NASA分類 | Composite Materials |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/258819 |
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