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タイトルDevelopment of Flexible Multilayer Circuits and Cables
本文(外部サイト)http://hdl.handle.net/2060/20110016479
著者(英)Holloway, Nancy; Draughon, Fred; Barnes, Kevin N.; Bryant, Robert
著者所属(英)NASA Langley Research Center
発行日2005-12-01
言語eng
内容記述A continuing program addresses the development of flexible multilayer electronic circuits and associated flexible cables. This development is undertaken to help satisfy aerospace-system-engineering requirements for efficient, lightweight electrical and electronic subsystems that can fit within confined spaces, adhere to complexly shaped surfaces, and can be embedded within composite materials. Heretofore, substrate layers for commercial flexible circuitry have been made from sheets of Kapton (or equivalent) polyimide and have been bonded to copper conductors and to other substrate layers by means of adhesives. The substrates for the present developmental flexible circuitry are made from thin films of a polyimide known as LaRC(TM)-SI. This polyimide is thermoplastic and, therefore, offers the potential to eliminate delamination and the need for adhesives. The development work undertaken thus far includes experiments in the use of several techniques of design and fabrication (including computer-aided design and fabrication) of representative flexible circuits. Anticipated future efforts would focus on multilayer bonding, fabrication of prototypes, and overcoming limitations.
NASA分類Man/System Technology and Life Support
レポートNOLAR-16503
権利Copyright, Distribution as joint owner in the copyright


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