| タイトル | Solder Creep-Fatigue Interactions with Flexible Leaded Part |
| 著者（英） | Wen, L. C.; Ross, R. G., Jr. |
| 発行日 | 1994-01-01 |
| 言語 | eng |
| 内容記述 | In most electronic packaging applications it is not a single high stress event that breaks a component solder joint; rather it is repeated or prolonged load applications that result in fatigue or creep failure of the solder. The principal strain in solder joints is caused by differential expansion between the part and its mounting environment due to hanges in temperature (thermal cycles) and/or due to temperature gradients between the part and the board. |
| 権利 | Copyright |
|
