タイトル | Low Pressure and Low Temperature Hermetic Wafer Bonding Using Microwave Heating |
著者(英) | Jackson, H. W.; Barmatz, M.; Budraa, N.; Mai, J. D.; Pike, W. T. |
発行日 | 1999-01-17 |
言語 | eng |
内容記述 | We bonded gold on silicon substrates (Au/Si) for a MEMS application by using microwave radiation in a single-mode cavity. |
権利 | Copyright |
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