| タイトル | Probabilistic Fatigue Life Analysis of High Density Electronics Packaging |
| 著者（英） | Creager, M.; Sutharshana, S.; Newlin, L. E.; Moore, N. R.; Kolawa, E. A. |
| 発行日 | 1996-08-07 |
| 言語 | eng |
| 内容記述 | The fatigue of thin film metal interconnections in high density electronics packaging subjected to thermal cycling has been evaluated using a probabilistic fracture mechanics methodology. This probabilistic methodology includes characterization of thin film stress using an experimentally calibrated finite element model and simulation of flaw growth in the thin films using a stochastic crack growth model. |
| 権利 | Copyright |
|
