| タイトル | The In-Space Soldering Investigation: Research Conducted on the International Space Station in Support of NASA's Exploration Initiative |
| 著者（英） | Funkhouser, G.; Fincke, M.; Hua, F.; Parris, F.; Grugel, R. N.; Ogle, J. A.; Murphy, L.; Gillies, D.; Sergre, P. N. |
| 著者所属（英） | NASA Marshall Space Flight Center |
| 発行日 | 2004-01-01 |
| 言語 | eng |
| 内容記述 | Soldering is a well established joining and repair process that is of particular importance in the electronics industry. Still. internal solder joint defects such as porosity are prevalent and compromise desired properties such as electrical/thermal conductivity and fatigue strength. Soldering equipment resides aboard the International Space Station (ISS) and will likely accompany Exploration Missions during transit to, as well as on, the moon and Mars. Unfortunately, detrimental porosity appears to be enhanced in lower gravity environments. To this end, the In-Space Soldering Investigation (ISSI) is being conducted in the Microgravity Workbench Area (MWA) aboard the ISS as "Saturday Science" with the goal of promoting our understanding of joining techniques, shape equilibrium, wetting phenomena, and microstructural development in a microgravity environment. The work presented here will focus on direct observation of melting dynamics and shape determination in comparison to ground-based samples, with implications made to processing in other low-gravity environments. Unexpected convection effects, masked on Earth, will also be shown as well as the value of the ISS as a research platform in support of Exploration Missions. |
| NASA分類 | Electronics and Electrical Engineering |
| 権利 | No Copyright |
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