| タイトル | Copper Alloy For High-Temperature Uses |
| 著者（英） | Ellis, David L.; Michal, Gary; Dreshfield, Robert L. |
| 著者所属（英） | NASA Lewis Research Center |
| 発行日 | 1994-08-01 |
| 言語 | eng |
| 内容記述 | Alloy of Cu/8Cr/4Nb (numbers indicate parts by atom percent) improved over older high-temperature copper-based alloys in that it offers enhanced high temperature strength, resistance to creep, and ductility while retaining most of thermal conductivity of pure copper; in addition, alloy does not become embrittled upon exposure to hydrogen at temperatures as high as 705 degrees C. Designed for use in presence of high heat fluxes and active cooling; for example, in heat exchangers in advanced aircraft and spacecraft engines, and other high-temperature applications in which there is need for such material. High conductivity and hardness of alloy exploited in welding electrodes and in high-voltage and high-current switches and other applications in which wear poses design problem. |
| NASA分類 | MATERIALS |
| レポートNO | 94B10443
LEW-15768 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/313157 |
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