| タイトル | Comparison of full 3-D, thin-film 3-D, and thin-film plate analyses of a postbuckled embedded delamination |
| 著者（英） | Whitcomb, John D. |
| 著者所属（英） | NASA Langley Research Center |
| 発行日 | 1989-05-01 |
| 言語 | eng |
| 内容記述 | Strain-energy release rates are often used to predict when delamination growth will occur in laminates under compression. Because of the inherently high computational cost of performing such analyses, less rigorous analyses such as thin-film plate analysis were used. The assumptions imposed by plate theory restrict the analysis to the calculation of total strain energy, G(sub t). The objective is to determine the accuracy of thin-film plate analysis by comparing the distribution of G(sub t) calculated using fully three dimensional (3D), thin-film 3D, and thin-film plate analyses. Thin-film 3D analysis is the same as thin-film plate analysis, except 3D analysis is used to model the sublaminate. The 3D stress analyses were performed using the finite element program NONLIN3D. The plate analysis results were obtained from published data, which used STAGS. Strain-energy release rates were calculated using variations of the virtual crack closure technique. The results demonstrate that thin-film plate analysis can predict the distribution of G(sub t) quite well, at least for the configurations considered. Also, these results verify the accuracy of the strain-energy release rate procedure for plate analysis. |
| NASA分類 | ENGINEERING (GENERAL) |
| レポートNO | 93N10480 |
| 権利 | Copyright |
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