| タイトル | High-performance packaging for monolithic microwave and millimeter-wave integrated circuits |
| 著者（英） | Shalkhauser, K. A.; Shih, Y. C.; Li, K. |
| 著者所属（英） | NASA Lewis Research Center |
| 発行日 | 1992-03-01 |
| 言語 | eng |
| 内容記述 | Packaging schemes are developed that provide low-loss, hermetic enclosure for enhanced monolithic microwave and millimeter-wave integrated circuits. These package schemes are based on a fused quartz substrate material offering improved RF performance through 44 GHz. The small size and weight of the packages make them useful for a number of applications, including phased array antenna systems. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. |
| NASA分類 | ELECTRONICS AND ELECTRICAL ENGINEERING |
| レポートNO | 92A31706
AIAA PAPER 92-1935 |
| 権利 | Copyright |
