| タイトル | Rapid thermal cycling of new technology solar array blanket coupons |
| 著者（英） | Smith, Bryan K.; Mesch, Hans G.; Scheiman, David A.; Kurland, Richard M. |
| 著者所属（英） | Sverdrup Technology, Inc.|NASA Lewis Research Center|TRW, Inc. |
| 発行日 | 1990-01-01 |
| 言語 | eng |
| 内容記述 | NASA Lewis Research Center is conducting thermal cycle testing of a new solar array blanket technologies. These technologies include test coupons for Space Station Freedom (SSF) and the advanced photovoltaic solar array (APSA). The objective of this testing is to demonstrate the durability or operational lifetime of the solar array interconnect design and blanket technology within a low earth orbit (LEO) or geosynchronous earth orbit (GEO) thermal cycling environment. Both the SSF and the APSA array survived all rapid thermal cycling with little or no degradation in peak performance. This testing includes an equivalent of 15 years in LEO for SSF test coupons and 30 years of GEO plus ten years of LEO for the APSA test coupon. It is concluded that both the parallel gap welding of the SSF interconnects and the soldering of the APSA interconnects are adequately designed to handle the thermal stresses of space environment temperature extremes. |
| NASA分類 | SPACECRAFT PROPULSION AND POWER |
| レポートNO | 91A38019 |
| 権利 | Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/348127 |
