| タイトル | Additives Lower Dielectric Constants Of Polyimides |
| 著者（英） | St. Clair, Anne K.; Proctor, Kenneth M.; Stoakely, Diane M.; Emerson, Burt R., Jr. |
| 著者所属（英） | NASA Langley Research Center |
| 発行日 | 1990-08-01 |
| 言語 | eng |
| 内容記述 | Dielectric constants as low as 2.43 make polyimides more attractive for electronic applications. Process makes aromatic condensation polyimide films and coatings with dielectric constants lowered by incorporation of diamic acid additives. Materials provide better electrical insulation without sacrificing temperature stability of polyimide binders. Applicable whenever high temperature, low absorption of moisture, and high electrical-insulation properties needed. Applications include semiconductors and printed-circuit boards for computer industry and possibly automotive industry. |
| NASA分類 | MATERIALS |
| レポートNO | 90B10408
LAR-13902 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/360703 |
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