| タイトル | Stress rate and proof-testing of silicon wafers |
| 著者（英） | Leipold, M. H.; Chen, C. P. |
| 著者所属（英） | Jet Propulsion Lab., California Inst. of Tech. |
| 発行日 | 1985-02-01 |
| 言語 | eng |
| 内容記述 | Fracture mechanics test methods were applied to evaluate the proof-test characteristics of single-crystal silicon wafers. The results indicate that the strength distribution of silicon wafers is truncated by proof-testing. No subcritical crack growth occurred during proof-loading, as inferred from the lack of a stress-rate effect on strength. Mechanical proof-testing appears to be an effective method for eliminating weak samples before cell processing. |
| NASA分類 | NONMETALLIC MATERIALS |
| レポートNO | 85A28366
ACS PAPER 28-BPS-83 |
| 権利 | Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/392295 |
