タイトル | Reaction bonded silicon nitride prepared from wet attrition-milled silicon |
著者(英) | Glasgow, T. K.; Herbell, T. P.; Shaw, N. J. |
著者所属(英) | NASA Lewis Research Center |
発行日 | 1980-01-01 |
言語 | eng |
内容記述 | Silicon powder wet milled in heptane was dried, compacted into test bar shape, helium-sintered, and then reaction bonded in nitrogen-4 vol% hydrogen. As-nitrided bend strengths averaged approximately 290 MPa at both room temperature and 1400 C. Fracture initiation appeared to be associated with subsurface flaws in high-strength specimens and both subsurface and surface flaws in low-strength specimens. |
NASA分類 | NONMETALLIC MATERIALS |
レポートNO | 80A32828 |
権利 | Copyright |
URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/422035 |
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