タイトル | Etching of transparent materials by laser ablation of an organic solution |
その他のタイトル | 有機溶液のレーザーアブレーションによる透明材料のエッチング |
著者(日) | Wang, Jun; 新納 弘之; 矢部 彰 |
著者(英) | Wang, Jun; Niino, Hiroyuki; Yabe, Akira |
著者所属(日) | 物質工学工業技術研究所; 物質工学工業技術研究所; 物質工学工業技術研究所 |
著者所属(英) | National Institute of Materials and Chemical Research; National Institute of Materials and Chemical Research; National Institute of Materials and Chemical Research |
発行日 | 2001-01 |
発行機関など | Institute of Physical and Chemical Research |
刊行物名 | RIKEN Review RIKEN Review |
号 | 32 |
開始ページ | 43 |
終了ページ | 46 |
刊行年月日 | 2001-01 |
言語 | eng |
抄録 | Transparent materials such as fused silica and quartz crystal were etched upon irradiation of an organic solution containing pyrene, using a conventional KrF or XeCl excimer laser. Threshold fluence for etching was 240 mJ/cm(sup 2) for fused silica, which was remarkably low compared with that of direct ablation using conventional lasers. The etch rates depended on the concentration of pyrene. The mechanism is explained by cyclic multiphotonic absorption of pyrene in the excited states, thermal relaxation, and formation of superheated solution. As the results, the transparent material is etched in a heating process by a superheated liquid and an attacking process by a high temperature and pressure vapor. |
キーワード | laser ablation; etching; transparent material; organic solution; pyrene; UV laser; cyclic multiphotonic absorption; excited state; thermal relaxation; superheated solution; KrF laser; research and development; レーザーアブレーション; エッチング; 透明材料; 有機溶液; ピレン; UVレーザー; 周期的多光子吸収; 励起状態; 熱緩和; 超加熱溶液; KrFレーザー; 研究開発 |
資料種別 | Conference Paper |
ISSN | 0919-3405 |
SHI-NO | AA0032140007 |
URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/42728 |