| タイトル | Adhesives for bonding RSI tile to Gr/Pi structure for advanced space transportation systems |
| 著者（英） | Smith, K. E.; Hogenson, P. A.; Hamermesh, C. L. |
| 著者所属（英） | Rockwell International Corp. |
| 発行日 | 1979-08-01 |
| 言語 | eng |
| 内容記述 | An adhesive was developed having improved high-temperature capability while retaining the ideal processing characteristics of RTV silicones. After evaluating several possibilities, mixtures of RTV with glass resins were selected as most promising. While results are not conclusive, tests of the final mixture evaluated, designated RA59, indicated capability of performing as a tile bonding agent to temperatures approaching 370C (700F) during repeated cycling. |
| NASA分類 | COMPOSITE MATERIALS |
| レポートNO | 79N30306 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/429919 |
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