| タイトル | Stitch-bond parallel-gap welding for IC circuits |
| 著者（英） | Tuttle, J.; Vanderpool, R.; Chvostal, P. |
| 著者所属（英） | NASA Johnson Space Center |
| 発行日 | 1980-06-01 |
| 言語 | eng |
| 内容記述 | Stitch-bonded flatpacks are superior to soldered dual-in-lines where size, weight, and reliability are important. Results should interest designers of packaging for complex high-reliability electronics, such as that used in security systems, industrial process control, and vehicle electronics. |
| NASA分類 | FABRICATION TECHNOLOGY |
| レポートNO | 79B10560
MSC-16459 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/430206 |
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