| タイトル | Energy distributions of sputtered copper neutrals and ions |
| 著者（英） | Lundquist, T. R. |
| 著者所属（英） | Maryland Univ. |
| 発行日 | 1978-04-01 |
| 言語 | eng |
| 内容記述 | Direct quantitative analysis of surfaces by secondary ion mass spectrometry will depend on an understanding of the yield ratio of ions to neutrals. This ratio as a function of the energy of the sputtered particles has been obtained for a clean polycrystalline copper surface sputtered by 1000-3000 eV Ar(+). The energy distributions of both neutral and ionized copper were measured with a retarding potential analyzer using potential modulation differentiation and signal averaging. The maximum for both distributions is identical and occurs near 2.5 eV. The energy distributions of neutrals is more sharply peaked than that of the ions, presumably as a consequence of more efficient nutralization of slow escaping ions by the mobile electrons of copper. The ion-neutral ratio is compared with results from various ionization models. |
| NASA分類 | METALLIC MATERIALS |
| レポートNO | 78A36043 |
| 権利 | Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/432715 |
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