| タイトル | Laser drilling of vias in dielectric for high density multilayer LSHI thick film circuits |
| 著者（英） | Cocca, T.; Dakesian, S. |
| 著者所属（英） | Raytheon Co. |
| 発行日 | 1977-11-01 |
| 言語 | eng |
| 内容記述 | A design analysis of a high density multilevel thick film digital microcircuit used for large scale integration is presented. The circuit employs 4 mil lines, 4 mil spaces and requires 4 mil diameter vias. Present screened and fired thick film technology is limited on a production basis to 16 mil square vias. A process whereby 4 mil diameter vias can be fabricated in production using laser technology was described along with a process to produce 4 mil diameter vias for conductor patterns which have 4 mil lines and 4 mil spacings. |
| NASA分類 | ELECTRONICS AND ELECTRICAL ENGINEERING |
| レポートNO | 78N16276 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/435417 |
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