| タイトル | Eliminating gold migration in microcircuits |
| 著者（英） | Dermarderosian, A.; Murphy, C. R. |
| 著者所属（英） | NASA Johnson Space Center |
| 発行日 | 1979-03-01 |
| 言語 | eng |
| 内容記述 | Report discusses how effects of moisture and other factors causing bridging between conductors can be prevented. Study details how several factors such as contaminants, large packages, high voltage, narrow conductor spacing and temperature contribute to moisture problems. |
| NASA分類 | ELECTRONIC COMPONENTS AND CIRCUITS |
| レポートNO | 78B10462
MSC-18213 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/435709 |
