| タイトル | Reliability of hybrid microcircuit bonding |
| 著者（英） | Caruso, S. V.; Allen, R. V.; Graff, S. M.; Kinser, D. L. |
| 著者所属（英） | NASA Marshall Space Flight Center |
| 発行日 | 1976-03-01 |
| 言語 | eng |
| 内容記述 | Microcircuit failure due to differential thermal expansion depends on technique used to mount components to substrate. Effects of differential thermal expansion on ceramic chip capacitors are investigated for various bonding techniques. |
| NASA分類 | FABRICATION TECHNOLOGY |
| レポートNO | 76B10129
MFS-23358 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/446089 |
