| タイトル | Capacitor bonding techniques and reliability |
| 著者（英） | Graff, S. M.; Allen, R. V.; Caruso, S. V.; Kinser, D. L. |
| 発行日 | 1974-01-01 |
| 言語 | eng |
| 内容記述 | The effect of thermal cycling on the mechanical failure of bonded ceramic chip capacitors mounted on alumina substrates is studied. It is shown that differential thermal expansion is responsible for the cumulative effects which lead to delayed failure of the capacitors. Harder or higher melting solders are found to be less susceptible to thermal cycling effects, although they are more likely to fail during initial processing operations. |
| NASA分類 | ELECTRONICS AND ELECTRICAL ENGINEERING |
| レポートNO | 75A34890 |
| 権利 | Copyright |
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