| タイトル | Flame sprayed dielectric coatings improve heat dissipation in electronic packaging |
| 本文（外部サイト） | http://hdl.handle.net/2060/19670000533 |
| 著者（英） | Vanaman, J. B.; Mackay, T. L.; Muller, A. N. |
| 発行日 | 1967-12-01 |
| 言語 | eng |
| 内容記述 | Heat sinks in electronic packaging can be flame sprayed with dielectric coatings of alumina or beryllia and finished off with an organic sealer to provide high heat and electrical resistivity. |
| NASA分類 | ELECTRONIC COMPONENTS AND CIRCUITS |
| レポートNO | 67B10534
MFS-13569 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/503644 |
