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タイトルChip connectivity verification program
本文(外部サイト)http://hdl.handle.net/2060/20080004490
著者(英)Riley, Josh; Patterson, George
著者所属(英)California Inst. of Tech.
発行日1999-09-07
言語eng
内容記述A method for testing electrical connectivity between conductive structures on a chip that is preferably layered with conductive and nonconductive layers. The method includes determining the layer on which each structure is located and defining the perimeter of each structure. Conductive layer connections between each of the layers are determined, and, for each structure, the points of intersection between the perimeter of that structure and the perimeter of each other structure on the chip are also determined. Finally, electrical connections between the structures are determined using the points of intersection and the conductive layer connections.
NASA分類Computer Operations and Hardware
権利No Copyright


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