| タイトル | ID wafering technology |
| 本文（外部サイト） | http://hdl.handle.net/2060/19820015779 |
| 著者（英） | Aharonyan, P. |
| 著者所属（英） | Silicon Technology Corp. |
| 発行日 | 1982-02-01 |
| 言語 | eng |
| 内容記述 | Improvements in ID saws leading to lower costs for producing silicon wafers for solar cells are described. The relationships between crystal size and blade size and between the length of time it takes to slice a wafer and wafer thickness are discussed. The influence of ingot production methods on wafering performance is considered. A cost sensitivity analysis of slicing a 10 cm square ingot and economic analyses of slicing a four inch and a six inch ingot are presented. A wafering cost model based on the IPEG 2 is given. |
| NASA分類 | ENERGY PRODUCTION AND CONVERSION |
| レポートNO | 82N23655 |
| 権利 | No Copyright |
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