| タイトル | Hybrid A/D converter for 200 deg C operation |
| 本文（外部サイト） | http://hdl.handle.net/2060/19820007456 |
| 著者（英） | Sullivan, M. R.; Toth, J. B. |
| 著者所属（英） | Micro Networks Corp. |
| 発行日 | 1981-01-01 |
| 言語 | eng |
| 内容記述 | A 12 bit A/D converter was designed and developed which will operate at 200 C with .05 linearity, 1/accuracy, 350 WSec conversion time, and only 455 mW power consumption. This product also necessitated the development of a unique three metal system in which aluminum wire bonding is done utilizing aluminum bonding pads, gold wire bonding to all gold areas, and employment of a nickel interface between gold and aluminum connections. This system totally eliminates the formation of a intermetallics at the bonding interface which can lead to bond failure. This product represents an advancement in electronics as it proved the operation of integrated circuits at high temperature, as well as providing information about both the electrical and mechanical reliability of hybrid circuits at 200 C. |
| NASA分類 | ELECTRONICS AND ELECTRICAL ENGINEERING |
| レポートNO | 82N15329 |
| 権利 | No Copyright |
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