タイトル | Plasma Deposited SiO2 for Planar Self-Aligned Gate Metal-Insulator-Semiconductor Field Effect Transistors on Semi-Insulating InP |
著者(英) | Smith, Edwyn D.; Tabory, Charles N.; Alterovitz, Samuel A.; Young, Paul G. |
著者所属(英) | NASA Lewis Research Center |
発行日 | 1994-02-01 |
言語 | eng |
内容記述 | Metal-insulator-semiconductor (MIS) field effect transistors were fabricated on InP substrates using a planar self-aligned gate process. A 700-1000 A gate insulator of Si02 doped with phosphorus was deposited by a direct plasma enhanced chemical vapor deposition at 400 mTorr, 275 C, 5 W, and power density of 8.5 MW/sq cm. High frequency capacitance-voltage measurements were taken on MIS capacitors which have been subjected to a 700 C anneal and an interface state density of lxl0(exp 11)/eV/cq cm was found. Current-voltage measurements of the capacitors show a breakdown voltage of 107 V/cm and a insulator resistivity of 10(exp 14) omega cm. Transistors were fabricated on semi-insulating InP using a standard planar self-aligned gate process in which the gate insulator was subjected to an ion implantation activation anneal of 700 C. MIS field effect transistors gave a maximum extrinsic transconductance of 23 mS/mm for a gate length of 3 microns. The drain current drift saturated at 87.5% of the initial current, while reaching to within 1% of the saturated value after only 1x10(exp 3). This is the first reported viable planar InP self-aligned gate transistor process reported to date. |
NASA分類 | Solid-State Physics |
レポートNO | 97N71966 NASA-TM-112737 NAS 1.15:112737 |
権利 | Copyright, Distribution as joint owner in the copyright |
URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/535371 |