JAXA Repository / AIREX 未来へ続く、宙(そら)への英知
titleTIMの密着具合に関する研究
Other TitleA Study on Contact Condition of Thermal Interface Material
Author(jpn)斎藤, 靖弘; 鈴木, 悟; 小室, 貴紀
Author(eng)Saito, Yasuhiro; Suzuki, Satoru; Komuro, Takanori
Author Affiliation(jpn)神奈川工科大学; 神奈川工科大学; 神奈川工科大学
Author Affiliation(eng)Kanagawa Institute of Technology; Kanagawa Institute of Technology; Kanagawa Institute of Technology
Issue Date2015-03-20
Publisher神奈川工科大学
Kanagawa Institute of Technology
Publication title神奈川工科大学研究報告
Research Reports of Kanagawa Institute of Technology
Issue39
Start page51
End page56
Publication date2015-03-20
Languagejpn
eng
AbstractRecently, the increasing performance of semiconductor devices has been accompanied by a simultaneous rise in the amount of heat they emit. When an electronic device is mounted on a metallic heat sink, a thermal interface material is required to handle the thermal energy emitted while simultaneously maintaining an acceptable level of electrical insulation. However, the thermal characteristics of thermal interface materials are strongly influenced by the manner in which they make contact with the heat sink. We proposed measuring the thermal characteristics of a thermal interface material placed on an aluminum plate that had been machine-milled to form precise grooves designed to simulate heat sink surface roughness, and called it a “non-flat plate”. This plate had nine 1-mm-wide 0.3-mm-deep grooves situated 4 mm apart. When pressure is applied to the thermal interface material, the material penetrates into these grooves, thus increasing contact between the two materials and consequently decreasing thermal resistance. Then, by varying the groove shapes and applied pressure amounts, contact conditions can be precisely controlled. This allows complex thermal parameters to be measured with good repeatability.
Description形態: カラー図版あり
形態: CD-ROM1枚
Physical characteristics: Original contains color illustrations
Note: One CD-ROM
KeywordsThermal Interface Material; Thermal Contact Resistance; AskerC Hardness
Document TypeDepartmental Bulletin Paper
NASA Subject CategorySolid-State Physics
ISSN2188-2878
NCIDAA12669200
SHI-NOAA1540099010
URIhttps://repository.exst.jaxa.jp/dspace/handle/a-is/553005


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