| タイトル | Silicon Alignment Pins: An Easy Way to Realize a Wafer-to-Wafer Alignment |
| 本文（外部サイト） | http://hdl.handle.net/2060/20130014523 |
| 著者（英） | Lin, Robert H.; Jung-Kubiak, Cecile; Peralta, Alejandro; Mehdi, Imran; Lee, Choonsup; Chattopadhyay, Goutam; Thomas, Bertrand; Siles, Jose; Cooper, Ken B.; Reck, Theodore J.; Gill, John J.; Toda, Risaku |
| 著者所属（英） | Jet Propulsion Lab., California Inst. of Tech. |
| 発行日 | 2013-12-01 |
| 言語 | eng |
| 内容記述 | Submillimeter heterodyne instruments play a critical role in addressing fundamental questions regarding the evolution of galaxies as well as being a crucial tool in planetary science. To make these instruments compatible with small platforms, especially for the study of the outer planets, or to enable the development of multi-pixel arrays, it is essential to reduce the mass, power, and volume of the existing single-pixel heterodyne receivers. Silicon micromachining technology is naturally suited for making these submillimeter and terahertz components, where precision and accuracy are essential. Waveguide and channel cavities are etched in a silicon bulk material using deep reactive ion etching (DRIE) techniques. Power amplifiers, multiplier and mixer chips are then integrated and the silicon pieces are stacked together to form a supercompact receiver front end. By using silicon micromachined packages for these components, instrument mass can be reduced and higher levels of integration can be achieved. A method is needed to assemble accurately these silicon pieces together, and a technique was developed here using etched pockets and silicon pins to align two wafers together. |
| NASA分類 | Astronomy; Electronics and Electrical Engineering |
| レポートNO | NPO-48079/608 |
| 権利 | Copyright, Distribution as joint owner in the copyright |
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