| タイトル | A Novel Silicon Micromachined Integrated MCM Thermal Management System |
| 本文（外部サイト） | http://hdl.handle.net/2060/20010092601 |
| 著者（英） | Henderson, H. T.; Gerner, F. M.; Kazmierczak, M. J. |
| 著者所属（英） | Cincinnati Univ. |
| 発行日 | 1999-01-07 |
| 言語 | eng |
| 内容記述 | This research concerned the development of a novel porous wick, fabricated totally out of silicon, using state-of-the-art MEMS technology. A comprehensive summary of results, as well as additional fabrication details, can be found in the following three documents located in the attached Appendices: A) Selected pages and excerpts from Year 2 progress report of the principal NASA Grant awarded from NASA Lewis Research Center, Grant Number NAG3-1706 entitled "A Novel Silicon Nficromachined Integrated MCM Thermal Management System" submitted to NASA LRC on 4/4/98. B) Selected viewgraphs from the joint NASA, TEES, and UC meeting held at the University of Cincinnati on April 24, 1998. C) Pre-print of the paper entitled "Coherent Macro Porous Silicon as a Wick Structure in an Integrated Nficrofluidic Two-Phase Cooling System" to be presented September 20-25, 1998 at the SPIE conference held in Santa Clara, Ca. To summarize,. nearly all of the proposed work was successfully accomplished (albeit a 3-month time extension was required), proving that micromachining can indeed be used to fabricate porous silicon wick structures with precise hole sizes and patterning control, thus permitting a substantial improvement in future wick designs. In addition, the appropriate range of thermal conductivities of the porous samples were theoretically predicted (see Appendix A). Although not part of the scope of work, the permeability of the test samples were measured (see results sections of Appendices B and C). |
| NASA分類 | Electronics and Electrical Engineering |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/92526 |
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