| タイトル | Improved Electroformed Structural Copper and Copper Alloys |
| 本文（外部サイト） | http://hdl.handle.net/2060/19990008955 |
| 著者（英） | Hudson, W.; Malone, G. A.; Babcock, B.; Edwards, R. |
| 著者所属（英） | Electroformed Nickel, Inc. |
| 発行日 | 1998-11-01 |
| 言語 | eng |
| 内容記述 | Electroforming offers a superior means for fabricating internally cooled heat exchangers and structures subjected to thermal environments. Copper is deposited from many such applications because of the good thermal conductivity. It suffers from mediocre yield strength as a structural material and loses mechanical strength at intermediate temperatures. Mechanical properties similar to those of electroformed nickel are desired. Phase 1 examined innovative means to improve deposited copper structural performance. Yield strengths as high as 483 MPa (70 ksi) were obtained with useful ductility while retaining a high level of purity essential to good thermal conductivity. Phase 2 represents a program to explore new additive combinations in copper electrolytes to produce a more fine, equiaxed grain which can be thermally stabilized by other techniques such as alloying in modest degrees and dispersion strengthening. Evaluation of new technology - such as the codeposition of fullerness (diamond-like) particles were made to enhance thermal conductivity in low alloys. A test fire quality tube-bundle engine was fabricated using these copper property improvement concepts to show the superiority of the new coppers and fabrications methods over competitive technologies such as brazing and plasma deposition. |
| NASA分類 | Metallic Materials |
| レポートNO | E-11417
NAS 1.26:208680
NASA/CR-1998-208680 |
| 権利 | No Copyright |
| URI | https://repository.exst.jaxa.jp/dspace/handle/a-is/97082 |
